Semiconductor devices having through-vias and methods for fabricating the same

ABSTRACT

A conductive via of a semiconductor device is provided extending in a vertical direction through a substrate, a first end of the conductive via extending through a first surface of the substrate, so that the first end protrudes in the vertical direction relative to the first surface of the substrate. An insulating layer is provided on the first end of the conductive via and on the first surface of the substrate. An upper portion of a mask layer pattern is removed so that a capping portion of the insulating layer that is on the first end of the conductive via is exposed. A portion of the insulating layer at a side of, and spaced apart from, the conductive via, is removed, to form a recess in the insulating layer. The capping portion of the insulating layer on the first end of the conductive via is simultaneously removed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. nonprovisional patent application claims priority under 35U.S.C. §119 of Korean Patent Application 10-2012-0149578 filed Dec. 20,2012, the entire contents of which are hereby incorporated by reference.

BACKGROUND

The present inventive concepts relate to semiconductor devices and, moreparticularly, to semiconductor devices having through-vias and methodsfor fabricating the same.

Generally, in the fabrication of semiconductor devices havingthrough-silicon vias, the through-vias may be configured to protrude inan outward direction from a non-active surface of a substrate. Aninsulation layer is then deposited on the non-active surface, and thedeposited insulation layer may then be polished so that the through-viasbecome exposed through the polished insulation layer. A protrusionsection may be present on the through-via because the insulation layeris deposited on the protruded through-via. If protruded length of theprotrusion section over the through-vias is large, the through-via maybe fractured or otherwise damaged during the polishing process. As aresult, yield of fabrication of the semiconductor device may drop andreliability of the resulting devices may possibly suffer.

SUMMARY

Embodiments of the inventive concepts provide semiconductor deviceshaving through-vias capable of reducing the protrusion length over thethrough-via and having improved yield and methods for fabricating thesame.

Other embodiments of the inventive concepts provide semiconductordevices having through-vias capable of preventing damage of thethrough-via and methods for fabricating the same.

Still other embodiments of the inventive concepts provide semiconductordevices having through-vias capable of reducing contamination of thethrough-via and methods for fabricating the same.

In an aspect, a method of forming a semiconductor device, comprises:providing a conductive via extending in a vertical direction through asubstrate, a first end of the conductive via extending through a firstsurface of the substrate, so that the first end protrudes in thevertical direction relative to the first surface of the substrate;providing an insulating layer on the first end of the conductive via andon the first surface of the substrate; providing a mask layer on theinsulating layer, and patterning the mask layer to form a mask layerpattern, the mask layer pattern having an opening at a side of theconductive via; removing an upper portion of the mask layer pattern sothat a capping portion of the insulating layer that is on the first endof the conductive via is exposed; and removing a portion of theinsulating layer at a side of, and spaced apart from, the conductivevia, using the mask layer pattern as an etch mask, to form a recess inthe insulating layer, and simultaneously removing the capping portion ofthe insulating layer on the first end of the conductive via.

In some embodiments, the recess comprises an alignment key of thesemiconductor device.

In some embodiments, the method further comprises following removing theportion of the insulating layer at a side of, and spaced apart from, theconductive via, using the mask layer pattern as an etch mask, to formarecess in the insulating layer, and simultaneously removing the cappingportion of the insulating layer: planarizing the first end of theconductive via.

In some embodiments, planarizing the first end of the conductive viafurther results in upper corner portions of the alignment key opening inthe insulating layer have a rounded cross-sectional profile.

The method of claim 1b further comprising applying a conductive pad tothe planarized first end of the conductive via.

In some embodiments, the method further comprises, prior to removing theportion of the insulating layer at a side of, and spaced apart from, theconductive via, using the mask layer pattern as an etch mask, andsimultaneously removing the capping portion of the insulating layer:removing at least an upper portion of the mask layer pattern.

In some embodiments, the method further comprises, following removingthe portion of the insulating layer at a side of, and spaced apart from,the conductive via, using the mask layer pattern as an etch mask, andsimultaneously removing the capping portion of the insulating layer:removing the mask layer pattern.

In some embodiments, forming the insulating layer comprises: forming alower insulating layer on the first end of the conductive via and on thefirst surface of the substrate; and forming an upper insulating layer onthe lower insulating layer, the upper insulating layer having etchselectivity with respect to the lower insulating layer; wherein removinga portion of the insulating layer comprises removing at least a portionof the upper insulating layer to form the recess in the upper insulatinglayer.

In some embodiments, removing a portion of the insulating layer furthercomprises removing at least a portion of the lower insulating layer tofurther form the recess in the lower insulating layer.

In some embodiments, providing a mask layer on the insulating layercomprises providing a first portion of the mask layer to a first depthon first surface of the substrate and providing a second portion of themask layer to a second depth on the first end of the conductive via andwherein the first depth is greater than the second depth.

In some embodiments, providing the mask layer comprises providing themask layer to include an upper surface that is substantially planar

In some embodiments, the first portion of the mask layer has an uppersurface that is at a first height relative to an upper surface of thesubstrate and wherein the insulating layer on the first end of theconductive via has an upper surface that is at a second height relativeto the upper surface of the substrate, and wherein the first height isless than the second height.

In some embodiments, the first portion of the mask layer has an uppersurface that is at a first height relative to an upper surface of thesubstrate and wherein the capping portion of the insulating layer has anupper surface that is at a second height relative to the upper surfaceof the substrate, and wherein the first height is greater than thesecond height.

In some embodiments, the method further comprises further removing anupper portion of that mask layer pattern to form a recessed mask layerpattern, and removing a portion of the insulating layer at a side of,and spaced apart from, the conductive via, using the recessed mask layerpattern as an etch mask.

In some embodiments, patterning the mask layer to form a mask layerpattern comprises: forming a first exposure region that is fully exposedto light energy and a second exposure region that is partially exposedto light energy; forming an opening that exposes a portion of theinsulating layer corresponding to the recess by removing the firstexposure region; and forming an opening that exposes a portion of theinsulating layer corresponding to the capping portion by removing thesecond exposure region.

In an aspect, a method of forming a semiconductor device, comprises:providing a conductive via extending in a vertical direction through asubstrate, a first end of the conductive via extending through a firstsurface of the substrate, so that the first end projects in a verticaldirection relative to the first surface of the substrate; providing aninsulating layer on the first end of the conductive via and on the firstsurface of the substrate; providing a mask layer on the insulatinglayer, and patterning the mask layer to form a mask layer pattern, themask layer pattern having an opening at a side of the conductive via;removing an upper portion of the mask layer pattern so that a cappingportion of the insulating layer that is on the first end of theconductive via is exposed; and removing a portion of the insulatinglayer at a side of, and spaced apart from, the conductive via, using themask layer pattern as an etch mask, to form an alignment key opening inthe insulating layer; and following forming the alignment key opening,planarizing the first end of the conductive via.

In some embodiments, removing the portion of the insulating layer at aside of, and spaced apart from, the conductive via, using the mask layerpattern as an etch mask, to form an alignment key opening in theinsulating layer, is performed simultaneous with removing the cappingportion of the insulating layer on the first end of the conductive via.

In some embodiments, the method further comprises, following removingthe portion of the insulating layer at a side of, and spaced apart from,the conductive via, using the mask layer pattern as an etch mask, toform an alignment key opening in the insulating layer, andsimultaneously removing the capping portion of the insulating layer:planarizing the first end of the conductive via.

In some embodiments, planarizing the first end of the conductive viafurther results in upper corner portions of the alignment key opening inthe insulating layer have a rounded cross-sectional profile.

In some embodiments, the method further comprises, applying a conductivepad to the planarized first end of the conductive via.

In some embodiments, the method further comprises, prior to removing theportion of the insulating layer at a side of, and spaced apart from, theconductive via, using the mask layer pattern as an etch mask, andsimultaneously removing the capping portion of the insulating layer:removing at least an upper portion of the mask layer pattern.

In some embodiments, the method further comprises, following removingthe portion of the insulating layer at a side of, and spaced apart from,the conductive via, using the mask layer pattern as an etch mask, andsimultaneously removing the capping portion of the insulating layer:removing the mask layer pattern.

In some embodiments, forming the insulating layer comprises: forming alower insulating layer on the first end of the conductive via and on thefirst surface of the substrate; and forming an upper insulating layer onthe lower insulating layer, the upper insulating layer having etchselectivity with respect to the lower insulating layer; wherein removinga portion of the insulating layer comprises removing at least a portionof the upper insulating layer to form the recess in the upper insulatinglayer.

In some embodiments, removing a portion of the insulating layer furthercomprises removing at least a portion of the lower insulating layer tofurther form the recess in the lower insulating layer.

In some embodiments, providing a mask layer on the insulating layer,comprises providing a first portion of the mask layer to a first depthon first surface of the substrate and providing a second portion of themask layer to a second depth on the first end of the conductive via andwherein the first depth is greater than the second depth.

In some embodiments, providing the mask layer comprises providing themask layer to include an upper surface that is substantially planar.

In some embodiments, the first portion of the mask layer has an uppersurface that is at a first height relative to an upper surface of thesubstrate and wherein the insulating layer on the first end of theconductive via has an upper surface that is at a second height relativeto the upper surface of the substrate, and wherein the first height isless than the second height.

In some embodiments, the first portion of the mask layer has an uppersurface that is at a first height relative to an upper surface of thesubstrate and wherein the capping portion of the insulating layer has anupper surface that is at a second height relative to the upper surfaceof the substrate, and wherein the first height is greater than thesecond height.

In some embodiments, the method further comprises, further removing anupper portion of that mask layer pattern to form a recessed mask layerpattern, and removing a portion of the insulating layer at a side of,and spaced apart from, the conductive via, using the recessed mask layerpattern as an etch mask.

In some embodiments, patterning the mask layer to form a mask layerpattern comprises: forming a first exposure region that is fully exposedto light energy and a second exposure region that is partially exposedto light energy; forming an opening that exposes a portion of theinsulating layer corresponding to the recess by removing the firstexposure region; and forming an opening that exposes a portion of theinsulating layer corresponding to the capping portion by removing thesecond exposure region.

In an aspect, a semiconductor device comprises: a substrate comprising afirst surface and an opposed, second surface, the substrate extending ina horizontal direction of extension; an insulation layer on the firstsurface of the substrate; a conductive via extending through thesubstrate in a vertical direction of extension relative to thehorizontal direction of extension of the substrate, a first end of theconductive via extending through the first surface of the substrate sothat the first end protrudes in the vertical direction relative to thefirst surface of the substrate; and an alignment key recess in theinsulation layer at a side of, and spaced apart from, the conductivevia, an outermost edge of the alignment key recess having a roundedcross-sectional profile.

In some embodiments, the semiconductor device further comprises aconductive terminal pad on the first end of the conductive via.

In some embodiments, the insulation layer comprises a lower insulationlayer on the first surface of the substrate and an upper insulationlayer on the lower insulation layer, wherein the lower insulation layerand the upper insulation layer have different etch selectivities withrespect to each other, and wherein the alignment key recess is in theupper insulation layer.

In some embodiments, wherein the alignment key recess comprises apartial recess in the upper insulation layer.

In some embodiments, the alignment key recess comprises a completerecess in the upper insulation layer.

In some embodiments, wherein the alignment key recess comprises acomplete recess in the upper insulation layer and a partial recess inthe lower insulation layer.

In some embodiments, wherein the lower insulation layer extends from thefirst surface of the substrate along a sidewall of the conductive via.

In some embodiments, the semiconductor device further comprises a viainsulation layer between sidewalls of the conductive via

In some embodiments, the semiconductor device comprises first and secondstacked semiconductor devices, and wherein the conductive via of thefirst semiconductor device and the conductive via of the secondsemiconductor device are connected at a conductive terminal.

In some embodiments, the conductive terminal is aligned between theconductive via of the first semiconductor device and the conductive viaof the second semiconductor device.

In some embodiments, the conductive terminal is horizontally offset sothat it is not aligned between the conductive via of the firstsemiconductor device and the conductive via of the second semiconductordevice.

In another aspect, a memory system comprises: a memory controller thatgenerates command and address signals; and a memory module comprising aplurality of memory devices, the memory module receiving the command andaddress signals and in response storing and retrieving data to and fromat least one of the memory devices, wherein each memory devicecomprises: a substrate comprising a first surface and an opposed, secondsurface, the substrate extending in a horizontal direction of extension;an insulation layer on the first surface of the substrate; a conductivevia extending through the substrate in a vertical direction of extensionrelative to the horizontal direction of extension of the substrate, afirst end of the conductive via extending through the first surface ofthe substrate so that the first end protrudes in the vertical directionrelative to the first surface of the substrate; and an alignment keyrecess in the insulation layer at a side of, and spaced apart from, theconductive via, an outermost edge of the alignment key recess having arounded cross-sectional profile.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of example embodimentsof inventive concepts will be apparent from the more particulardescription of non-limiting embodiments of inventive concepts, asillustrated in the accompanying drawings in which like referencecharacters refer to the same parts throughout the different views. Thedrawings are not necessarily to scale, emphasis instead being placedupon illustrating the principles of inventive concepts. In the drawings:

FIG. 1 is a cross-sectional view illustrating a semiconductor deviceaccording to some exemplary embodiments of the present inventiveconcepts.

FIG. 2A is a cross-sectional view illustrating an electricalinterconnection part according to some exemplary embodiments of thepresent inventive concepts.

FIGS. 2B and 2C are cross-sectional views illustrating alignment keysaccording to some exemplary embodiments of the present inventiveconcepts.

FIG. 2D is a cross-sectional view illustrating various dimensions of analignment key according to some exemplary embodiments of the presentinventive concepts.

FIGS. 3A and 3B are cross-sectional views illustrating electricalinterconnection parts according to some exemplary embodiments of thepresent inventive concepts.

FIGS. 4A and 4B are cross-sectional views illustrating semiconductorpackages according to some exemplary embodiments of the presentinventive concepts.

FIGS. 5A to 5P are cross-sectional views illustrating a method forfabricating a semiconductor device according to some embodiments of theinventive concepts.

FIGS. 6A to 6C are cross-sectional views illustrating a method forfabricating a semiconductor device according to some embodiments of theinventive concepts.

FIGS. 7A to 7C are cross-sectional views illustrating a method forfabricating a semiconductor device according to some embodiments of theinventive concepts.

FIG. 8A is a schematic block diagram illustrating an example of memorycard including at least one of electrical interconnection partsaccording to some embodiments of the present inventive concepts.

FIG. 8B is a schematic block diagram illustrating an example ofinformation process system including at least one of electricalinterconnection parts according to some embodiments of the presentinventive concepts.

DETAILED DESCRIPTION

Example embodiments of inventive concepts will now be described morefully hereinafter with reference to the accompanying drawings, in whichsome example embodiments of inventive concepts are shown. Exampleembodiments, may, however, be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein; rather, these example embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of example embodiments of inventive concepts to those of ordinaryskill in the art. In the drawings, the thicknesses of layers and regionsare exaggerated for clarity. Like reference numerals in the drawingsdenote like elements, and thus their description may be omitted.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. As used herein the term “and/or” includesany and all combinations of one or more of the associated listed items.Other words used to describe the relationship between elements or layersshould be interpreted in a like fashion (e.g., “between” versus“directly between,” “adjacent” versus “directly adjacent,” “on” versus“directly on”).

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises”, “comprising,”, “includes” and/or “including”, when usedherein, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of exampleembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, example embodiments should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle may have rounded or curved features and/or a gradient ofimplant concentration at its edges rather than a binary change fromimplanted to non-implanted region. Likewise, a buried region formed byimplantation may result in some implantation in the region between theburied region and the surface through which the implantation takesplace. Thus, the regions illustrated in the figures are schematic innature and their shapes are not intended to illustrate the actual shapeof a region of a device and are not intended to limit the scope ofexample embodiments.

It will be also understood that although the terms first, second, thirdetc. may be used herein to describe various elements, these elementsshould not be limited by these terms. These terms are only used todistinguish one element from another element. Thus, a first element insome embodiments could be termed a second element in other embodimentswithout departing from the teachings of example embodiments of inventiveconcepts. Aspects of example embodiments of inventive concepts explainedand illustrated herein include their complementary counterparts. Thesame reference numerals or the same reference designators denote thesame elements throughout the specification.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, such as those defined incommonly-used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

FIG. 1 is a cross-sectional view illustrating a semiconductor deviceaccording to some exemplary embodiments of the present inventiveconcepts.

Referring to FIG. 1, a semiconductor device 1 may comprise an electricalinterconnection part 10 which is configured, or otherwise constructedand arranged to transmit an electrical signal in a vertical directionthrough a substrate 100. The electrical interconnection part 10 maycomprise a through-via 120. In some embodiments, the through-via 120extends in a substantially vertical direction of extension relative to ahorizontal direction of extension of the substrate 100. A via isolationlayer 110 may be positioned between the through-via 120 and thesubstrate 100. With the presence of the via isolation layer 110, thethrough-via 120 may be electrically isolated from the substrate 100. Abarrier layer 124 may be further provided between the through-via 120and the via isolation layer 110, thereby preventing constituent parts(e.g., copper) of the through-via 120 from being diffused into thesubstrate 100.

The semiconductor device 1 may further include at least one of an upperterminal 198 and a lower terminal 118 that are electrically connected tothe through-via 120. In some embodiments, the upper terminal 198 may bedisposed on an active surface 100 a of the substrate 100 and the lowerterminal 118 may be disposed on a non-active surface 100 c of thesubstrate 100. In some embodiments, the lower terminal 118 may bedisposed on an active surface 100 a of the substrate 100 and the upperterminal 198 may be disposed on a non-active surface 100 c of thesubstrate 100. In various embodiments, the upper terminal 198 and thelower terminal 118 may include various interconnection configurations,including solder balls, solder bumps, re-interconnections, and/or pads.In some embodiments, the upper terminal 198 may include a solder balland the lower terminal 118 may include a pad.

In various embodiments, an integrated circuit 103, a metalinterconnection 152, and an interlayer insulation layer 102 mayoptionally be disposed on the active surface 100 a of the substrate 100.The metal interconnection 152 may be electrically connected to theintegrated circuit 103 and have a single-layered structure or amulti-layered structure. The interlayer insulation layer 102 may beconstructed and arranged to cover the integrated circuit 103 and themetal interconnection 152. In some embodiments, an upper insulationlayer 107 may be disposed on the interlayer insulation layer 102. Theupper insulation layer 107 may have an opening that exposes a bondingpad 154 to which the upper terminal 198 is connected. The metalinterconnection 152 may in turn be electrically connected to thethrough-via 120, such that the integrated circuit 103 is therebyelectrically connected to the through-via 120. The through-via 120 maybe disposed through the substrate beyond an outer edge of the integratedcircuit 103 or within a horizontal boundary of the integrated circuit103.

In some embodiments, a lower insulation layer 111 having an alignmentkey 160 may be provided on the non-active surface 100 c of the substrate100. In some embodiments, the alignment key 160 may be formed bypatterning the lower insulation layer 111. In some embodiments, thealignment key 160 may be employed for the positional alignment of thelower terminal 118 during its formation. In some embodiments, thealignment key 160 may also optionally be used for alignment during astep when the semiconductor device 1 is stacked on one or more of thesame or different semiconductor devices. The alignment key 160 may bedisposed within and/or around a region defined by the integrated circuit103. For example, the alignment key 160 may reside in a region betweenthe through-vias 120 of a common integrated circuit (that is within theintegrated circuit region), or, alternatively, in a region outside thethrough-vias 120 of a common integrated circuit (that is outside theintegrated circuit region), or inside and outside the through-via 120(in both regions). In the present embodiment, the alignment key 160 maycomprise rounded corners. This feature is described in further detailherein. The electrical interconnection part 10 may be formed to havevarious structures as described with reference to FIGS. 2A, 3A and 3B.

FIG. 2A is a cross-sectional view illustrating an electricalinterconnection part according to some exemplary embodiments of thepresent inventive concepts. FIGS. 2B and 2C are cross-sectional viewsillustrating alignment keys according to some exemplary embodiments ofthe present inventive concepts. FIG. 2D is a cross-sectional viewillustrating various dimensions of an alignment key according to someexemplary embodiments of the present inventive concepts.

Referring to FIG. 2A, an electrical interconnection part 11 may have avia-middle structure including the through-via 120, which through-viamay be formed following formation of the integrated circuit 103 andprior to the formation of the metal interconnection 152. The interlayerinsulation layer 102 may include a first interlayer insulation layer 104formed on the active surface 100 a of the substrate 100 to cover theintegrated circuit 103 and a second interlayer insulation layer 106positioned on the first interlayer insulation layer 104 to cover themetal interconnection 152 and the bonding pad 154. The through-via 120may be electrically connected to the lower terminal 118 through thefirst interlayer insulation layer 104 and the substrate 100. In someembodiments, the through-via 120 may be formed to have a pillar shape.In some embodiments, the through-via 120 may have a bottom end 120 pwhich protrudes outward from the non-active surface 100 c of thesubstrate 100.

In some embodiments, the upper terminal 198 and the lower terminal 118may be vertically aligned with the through-via 120. Alternatively, insome embodiments, as illustrated in FIG. 4B, the upper terminal 198 maynot be vertically aligned with the through-via 120 and/or the lowerterminal 118 may be redistributed using the metal interconnection 152. Aplating layer 119 may be further provided on the lower terminal 118. Theplating layer 119 may comprise Au, Ag, Pt or any combination thereof. Anunder bump metal layer 170 may be further provided between thethrough-via 120 and the lower terminal 118.

In some embodiments, the lower insulation layer 111 may have amulti-layered structure including a first lower insulation layer 108 anda second lower insulation layer 109 which are stacked one atop theother. The first lower insulation layer 108 may be provided on thenon-active surface 100 c of the substrate 100 and the second lowerinsulation layer 109 may be provided on the first lower insulation layer108. Alternatively, the lower insulation layer 111 may have asingle-layered structure including one of the first and second lowerinsulation layers 108 and 109. In some embodiments, the first lowerinsulation layer 108 may cover the non-active surface 100 c and asidewall of the bottom end 120 p, thereby having an “L” shape. Forexample, the first lower insulation layer 108 may have an extension 108e which vertically extends from the non-active surface 100 c to cover orsurround the sidewall of the bottom end 120 p. The via isolation layer110 may protrude outward from, or beyond, the non-active surface 100 cand may be disposed between the bottom end 120 p of the through-via 120and the extension 108 e of the first lower insulation layer 108.

In some embodiments, the alignment key 160 may be formed by patterningthe second lower insulation layer 109. For example, a portion of thesecond lower insulation layer 109 may be removed by etching and chemicalmechanical polishing processes. The removed portion of the second lowerinsulation layer 109 may be defined as the alignment key 160. Thealignment key 160 may have non-sharp corners 162 that are rounded incross-section due to the chemical mechanical polishing process. Forexample, during the chemical mechanical process following the etchingprocess, an etched portion of the second insulation layer 109 may besubjected to locally increased pressure such that the corners 162 of thealignment key 160 may become rounded. The alignment key 160 maypartially expose the first lower insulation layer 108. In variousembodiments, the alignment key 160 may have a cross-sectional shape thatare generally circular, elliptical, oval-shaped, triangular,rectangular, star-shaped, cross-shaped or dash shaped from theperspective of a plan view.

Alternatively, in some embodiments, as illustrated in FIG. 2B, thesecond lower insulation layer 109 is not etched to a depth so as toexpose the first lower insulation layer 108. Accordingly, a portion ofthe second lower insulation layer 109 may be recessed to define thealignment key 160 in the shape of dent in the second lower insulationlayer 109. Alternatively, in some embodiments, as illustrated in FIG.2C, the first lower insulation layer 108 is over-etched such that theover-etched portion of the first lower insulation layer 108 maytherefore become a part of the alignment key 160.

Referring to FIG. 2D, in some embodiments, a first thickness T1 of thecorner 162 included in the alignment key 160 may be less than a secondthickness T2 of the second lower insulation layer 109. For example, thefirst thickness T1 may be the same as, or less than, half of the secondthickness T2. Alternatively, in some embodiments, the first thickness T1may be greater than half of the second thickness T2 according to acondition and/or a variation of the chemical mechanical process.Alternatively, the first thickness T1 may be greater or less than a halfof a third thickness T3 of the lower insulation layer 111 inclusive ofboth thicknesses of the first lower insulation layer 108 and the secondlower insulation layer 109.

FIGS. 3A and 3B are cross-sectional views illustrating electricalinterconnection parts according to some exemplary embodiments of thepresent inventive concepts.

Referring to FIG. 3A, in some embodiments, an electrical interconnectionpart 12 may have a via-last structure including the through-via 120,which may be formed following the sequential formation of the integratedcircuit 103 and the metal interconnection 152. The through-via 120 mayhave a pillar shape which successively penetrates both the interlayerinsulation layer 102 and the substrate 100. An upper interconnection 153may be further provided on the upper insulation layer 107. The upperinterconnection 153 may electrically connect the through-via 120 and thebonding pad 154 to each other. The through-via 120 may further penetratethe upper insulation layer 107 to be connected to the upperinterconnection 153.

Referring to FIG. 3B, in some embodiments, an electrical interconnectionpart 13 may have a via-first structure including the through-via 120,which may be formed before the integrated circuit 103 and the metalinterconnection 152 are sequentially formed. An additionalinterconnection 156 may be further provided on the active surface 100 aof the substrate 100 with an insulation layer 133 therebetween. Thethrough-via 120 may have a pillar shape which is electrically connectedto the metal interconnection 152 and/or the integrated circuit 103through a via 158. The via 158 may electrically connect the additionalinterconnection 156 and the metal interconnection 152 to each other.

FIGS. 4A and 4B are cross-sectional views illustrating semiconductorpackages according to some exemplary embodiments of the presentinventive concepts.

Referring to FIG. 4A, a semiconductor package 90 may include a packagesubstrate 80 and one or more semiconductor devices 1 of FIG. 1 mountedon the package substrate 80. The semiconductor package 90 may furtherinclude a molding layer 80 molding the semiconductor devices 1. Thepackage substrate 80 may include a top surface 80 a and a bottom surface80 b opposite to the top surface 80 a. The package substrate 80 may be aprinted circuit board (PCB) within which electrical interconnections 82are included. The semiconductor devices 1 may be mounted on the topsurface 80 a of the package substrate 80 in a face down state, such thatactive surfaces 100 a of the semiconductor devices 1 face the packagesubstrate 80. Alternatively, the semiconductor devices 1 may be mountedon the top surface 80 a of the package substrate 80 in a face up state.

In some embodiments, the semiconductor package 90 may further includeone or more solder balls 84, which are adhered on the bottom surface 80b of the package substrate 80 and are connected to the electricalinterconnections 82. In the present embodiment, the electricalconnections between the semiconductor devices 1 and between thesemiconductor devices 1 and the package substrate 80 may be realized bythe through-vias 120. The electrical interconnection parts 10 of thesemiconductor devices 1 may comprise one of the electricalinterconnection parts 11 to 13 illustrated in the present specification.The alignment key 160 may be used for the alignment in the stackformation of the semiconductor devices 1 so that the accurate alignmentbetween the semiconductor devices 1 may be realized.

Referring to FIG. 4B, a semiconductor package 95 may comprise aplurality of semiconductor devices 1 a and 1 b on the package substrate80. The semiconductor devices 1 a and 1 b may be identical or similar tothe semiconductor device 1 of FIG. 1A. For example, a firstsemiconductor device 1 a may comprise a first upper terminal 198 a whichis vertically aligned with a first through-via 120 a and a first lowerterminal 118 a which is redistributed. A second semiconductor device 1 bmay comprise a second upper terminal 198 b which is not verticallyaligned with a second through-via 120 b and a second lower terminal 118b which is not redistributed. Alternatively, The second lower terminal118 b may be redistributed. The second upper terminal 198 b may beelectrically connected to the redistributed first lower terminal 118 a.Other elements may be identical or similar to those of the semiconductorpackage 90 as illustrated in FIG. 4A.

FIGS. 5A to 5P are cross-sectional views illustrating a method forfabricating a semiconductor device according to some embodiments of theinventive concepts.

Referring to FIG. 5A, a via-hole 101 may be formed in a substrate 100.The substrate 100 may be a semiconductor substrate (for example, asilicon substrate) having a top surface, or active surface, 100 aprovided with the integrated circuit 103 and a first bottom surface 100b opposite the active surface 100 a. A first interlayer insulation layer104 may be formed on the top surface 100 a of the substrate 100 to coverthe integrated circuit 103. The integrated circuit 103 may be configuredto include a memory circuit, a logic circuit, or a combination thereof.The first interlayer insulation layer 104 may be formed by depositing asilicon oxide layer or a silicon nitride layer. The via-hole 101 may beformed to have a hollow pillar shape having an entrance near the topsurface 100 a of the substrate 100 but having such a depth as not topenetrate the first bottom surface 100 b. The via-hole 101 may extendfrom the top surface 100 a of the substrate 100 toward the first bottomsurface 100 b in a substantially vertical direction. The via-hole 101may be formed by a dry etching process or a drilling process on thefirst interlayer insulation layer 104 and the substrate 100. In someembodiments, the via-hole 101 may be formed near the integrated circuit103 (for example, a scribe lane or a region adjacent thereto) or at aregion provided with the integrated circuit 103.

Referring to FIG. 5B, an insulating layer 110 a may be formed to coat orcover an inner surface of the via hole 101 and then a conductive layer120 a may be formed on the substrate 100 to fill the via-hole 101. Insome embodiments, the insulating layer 110 a may be formed by depositinga silicon oxide layer or a silicon nitride layer. The conductive layer120 a may be formed by depositing or plating at least one of silicon,copper, tungsten, and aluminum. In a case where the conductive layer 120a includes copper, a metal layer 124 a which operates as ananti-diffusion layer, may be further formed on the insulating layer 110a which may prevent copper from being diffused. The metal layer 124 amay be formed by depositing metal, such as Ti, TiN, Cr, Ta, TaN, Ni, orany combination thereof, or other conductive material, which extendsalong the insulating layer 110 a.

Referring to FIG. 5C, the conductive layer 120 a and the insulatinglayer 110 a may be planarized to expose the first interlayer insulationlayer 104. The planarization process may be performed by an etch-backprocess or a chemical mechanical polishing (CMP) process. Due to theplanarization process, the conductive layer 120 a may be formed into apillar-shaped through-via 120 which vertically penetrates the firstinterlayer insulation layer 104 and the substrate 100, and theinsulating layer 110 a may be formed into a via isolation layer 110which electrically isolates the through-via 120 from the substrate 100.If the metal layer 124 a is further formed, due to the planarizationprocess, the metal layer 124 a may be formed into a barrier layer 124which prevents or reduces the likelihood of an element (e.g., copper) ofthe through-via 120 from being diffused into the substrate 100 or theintegrated circuit 103. For brevity of the drawings, the barrier layer124 will be omitted from the description hereinafter.

Referring to FIG. 5D, a back-end process may be performed. In someembodiments, a metal interconnection 152 of single-layered ormulti-layered structure coupled to the through-via 120, a bonding pad154 electrically connected to the metal interconnection 152, and asecond interlayer insulation layer 106 covering the metalinterconnection 152 and the bonding pad 154 may be formed on the firstinterlayer insulation layer 104. The metal interconnection 152 and thebonding pad 154 may be formed by depositing and patterning a metal suchas Cu or Al. The second interlayer insulation layer 106 may be formed bydepositing the same or similar insulator to the first interlayerinsulation layer 104. For example, the second interlayer insulationlayer 106 may be formed of a silicon oxide layer or a silicon nitridelayer. An upper insulation layer 107 may be formed on the secondinterlayer insulation layer 106. In various embodiments, the upperinsulation layer 107 may be formed by depositing and patterning asilicon oxide layer, a silicon nitride layer, or a polymer. The upperinsulation layer 107 may be formed to expose the bonding pad 154.Additionally, a bump process may be further performed to form an upperterminal 198 (e.g., a solder ball or a solder bump) coupled to thebonding pad 154.

Referring to FIG. 5E, the bottom surface 100 c of the substrate 100 maybe recessed to a depth so as to cause the through-via 120 to protrudetherefrom. For example, in various embodiments, the first bottom surface100 b of the substrate 100 may be recessed by an etching process usingan etchant or a slurry capable of selectively removing the material(e.g., silicon) constituting the substrate 100, a CMP process, agrinding process, or any combination thereof. The above-mentioned recessor protrusion process may be performed until a second bottom surface 100c is exposed. The second bottom surface 100 c may be more adjacent tothe top surface 100 a than the first bottom surface 100 b. Due to therecess or protrusion process, a bottom end 120 p of the through-via 120may be exposed from the second bottom surface 100 c. The recess orprotrusion process may be performed in a state that the substrate 100 issupported by a support substrate 70. The support substrate 70 may beadhered to the top surface 100 a of the substrate 100 with an adhesivelayer 72 therebetween. The top surface 100 a of the substrate 100 mayface upward or downward when the recess or protrusion process isperformed. In the present embodiment, the top surface 100 a of thesubstrate 100 may correspond to an active surface and the second bottomsurface 100 c may correspond to a non-active surface. In otherembodiments, the top surface 100 a may be non-active and the bottomsurface 100 b may be active, or both the top 100 a and bottom 100 bsurfaces may be active or inactive.

Referring to FIG. 5F, in some embodiments, a silicon oxide layer or asilicon nitride layer may be deposited on the non-active surface 100 cof the substrate 100 to form a first lower insulation layer 108 and asecond lower insulation layer 109. For example, a silicon oxide layermay be deposited on the non-active surface 100 c to form the first lowerinsulation layer 108, and a silicon nitride layer may be deposited onthe first lower insulation layer 108 to form the second lower insulationlayer 109. The first lower insulation layer 108 may have a thicknessless than that of the second lower insulation layer 109. The first lowerinsulation layer 108 may operate to fill gaps between the non-activesurface 100 c and the second lower insulation layer 109 and between thenon-active surface 100 c and the bottom end 120 p of the through-via120. The first and second lower insulation layers 108 and 109 may have abending or meandering cross-sectional shape as a result of theircovering the protruding bottom end 120 p of the through-via 120 on thenon-active surface 100 c. Therefore, in this manner, a protrusionsection 190 may be provided on the non-active surface 100 c of thesubstrate 100. Alternatively, in other embodiments, one of the first andsecond lower insulation layers 108 and 109 may be omitted so as to be asingle layer. For example, in some embodiments, the formation of thefirst insulation layer 108 may be skipped. In other embodiments, morethan two insulation layers 108, 109 can be used.

Referring to FIG. 5G, in some embodiments, a mask layer 130 may beformed on the second lower insulation layer 109 and then the mask layer130 may be exposed to light energy by a photolithography process using aphotomask 140 a. For example, a positive photoresist may be coated onthe second insulation layer 109 to form the mask layer 130 and then alocal region 141 of the mask layer 130 may be exposed to light. Thelocal region 141 may be provided to define an alignment key (seereference 160 of FIG. 5J) through subsequent processes. The photomask140 a may comprise a binary mask which is configured to fully expose themask layer 130 so that the local region 141 may be formed into a fullexposure region (e.g., 100% exposure). In some embodiments, the masklayer 130 may include a hillock which rises upward on the protrusionsection 190. The mask layer 130 may have a thickness that is irregular.For example, the mask layer 130 may have a portion with a firstthickness T1 on the non-active surface 100 c and a portion with a secondthickness T2 less than the first thickness T1 on the protrusion section190. The first thickness T1 of the mask layer 130 may be same or lessthan a protrusion length L of the protrusion section 190. Alternatively,the first thickness T1 of the mask layer 130 may be greater than theprotrusion length L of the protrusion section 190.

Referring to FIG. 5H, an opening 130 a may be formed to expose thesecond lower insulation layer 109. The opening 130 a may be formed bypatterning the mask layer 130 with a photographic developer capable ofselectively removing the exposure region 141. The opening 130 a may havea shape such as circle, ellipse, oval, triangle, rectangle, star, crossor dash when perceived from the perspective of a plan view.

Referring to FIG. 5I, in some embodiments, the mask layer 130 may berecessed. The recess process may expose a portion 109 f (referred to asa capping part hereinafter) of the second lower insulation layer 109 ofthe protrusion section 190 which is formed on the bottom end 120 p ofthe through-via 120.

Referring to FIG. 5J, an alignment key 160 may be formed. The cappingpart 109 f may be removed simultaneously with the formation of thealignment key 160. For example, the second lower insulation layer 109may be patterned by an etching process (e.g., dry etch) using therecessed mask layer 130. Due to the patterning of the second lowerinsulation layer 109, the alignment key 160 may be formed under theopening 130 a, and the capping part 109 f may be removed simultaneouslywith the formation of the alignment key 160.

Referring to FIG. 5K, the mask layer 130 may be stripped and then theremaining portion of the protrusion section 190 may be removed by aplanarization process. Alternatively, the mask layer 130 and theprotrusion section 190 may be removed simultaneously in a planarizationprocess. In some embodiments, the planarization process may be performedusing a CMP process. Since the capping part 109 f of the second lowerinsulation layer 109 has been previously removed as illustrated in FIG.5J, a polishing amount or depth P1 of the CMP process may be relativelyreduced as compared the amount of polishing that would otherwise benecessary to remove the capping part 109 f by CMP. In some embodiments,the second lower insulation layer 109 may have an extension 109 e whichextends in a vertical direction from the non-active surface 100 c tocover a sidewall of the bottom end 120 p. The planarization process(e.g., CMP) may be performed until a surface 109 s under the extension109 e of the second lower insulation layer 109 is exposed or polished.The CMP process may be thereby simplified because the capping part 109 fis removed prior to the performing of CMP process, and therefore theburden of the CMP process is reduced from a depth of P2 to a depth ofP1. Moreover, the decreased depth P1 of the CMP may prevent or reducethe likelihood of breakage or damage of the through-via 120.

According to exemplary embodiments, the formation of the alignment key160 as illustrated in FIG. 5J and the removal of the mask layer 130 asillustrated in FIG. 5K may be performed in a state whereby thethrough-via 120 is not exposed. For that reason, the through-via 120 maybe free of contamination due to byproducts created in etching processesfor the formation of the alignment key 160 and the removal of the masklayer 130. Additionally, there may be no room for particles to begenerate as a result of exposure of the through-via 120.

Referring to FIG. 5L, the planarization process may remove theprotrusion section 190 to expose a planarized bottom surface 120 s ofthe through-via 120. Due to the planarization process, a surface 109 sof the second lower insulation layer 109 may be planarized and coplanarwith the bottom surface 120 s of the through-via 120. In someembodiments, the resulting alignment key 160 may have rounded corners162. When the planarization process is performed, edge or cornerportions 162 of the second lower insulation layer 109 may be givenlocally increased pressure. Consequently, the resulting edge portions162 or corners of the alignment key 160, may have a roundedcross-section or profile. In some embodiments, as previously describedin FIG. 2D, a thickness of the corner 162 may be greater or less thanhalf the thickness of the second lower insulation layer 109 or half thethickness of the first and second lower insulation layers 108 and 109.In some embodiments, the bottom end 120 p of the through-via 120 may notbe completely polished, thereby the through-via 120 may have a shapethat protrudes outward from the non-active surface 100 c. The firstlower insulation layer 108 may be polished to have an “L” shapeincluding an extension 108 e which surrounds the sidewall of the bottomend 120 p of the through-via 120. The via isolation layer 110 may bepartially removed to have a protruded portion which protrudes outwardfrom the non-active surface 100 c when the protrusion section 190 ispolished. The protruded portion of the via isolation layer 110 may bedisposed between the bottom end 120 p of the through-via 120 and theextension 108 e of the first lower insulation layer 108.

Referring to FIG. 5M, a metal layer 170 a may be formed on thenon-active surface 100 c and a mask layer 135 may be formed on the metallayer 170 a. The metal layer 170 a may comprise Ni, Au or Ni/Au. Themask layer 135 may be formed by coating and patterning a photoresist.The mask layer 135 may comprise an opening 135 a vertically aligned withthe through-via 120.

Referring to FIG. 5N, a backside pad 118 may be formed on the metallayer 170 a by an electroplating process. In some embodiments, thebackside pad 118 may comprise Cu, Al, Ni or any combination thereof. Aplating layer 119 may be further formed on the backside pad 118. Theplating layer 119 may comprise Au, Ag, Pt or any combination thereof.The plating layer 119 may be provided for preventing an oxidation of thebackside pad 118 and improving an electrical contact between thebackside pad 118 and any electrical interconnection such as bondingwire, solder ball, and etc. The backside pad 118 and/or the platinglayer 119 may be confined within the opening 135 a.

Referring to FIG. 5O, the mask layer 135 may be removed by a stripprocess or an ashing process. The removal of the mask layer 135 mayexpose a metal layer 170 b which is a portion of the metal layer 170 acovered by the mask layer 135. The exposed metal layer 170 b may beremoved by an etching process to remain an under bump metal layer 170,which includes another portion of the metal layer 170 a covered by thebackside pad 118, between the backside pad 118 and the through-via 120.

Referring to FIG. 5P, the adhesive layer 72 and the support substrate 70may be detached from the substrate 100. Accordingly, there may be formedan electrical interconnection part 11 comprising the through-via 120, amulti-layered lower insulation layer 111 which includes the first andsecond lower insulation layers 108 and 109 stacked on the non-activesurface 100 c, and the alignment key 160 which is formed by patterningthe second lower insulation layer 109. The through-via 120 may comprisethe bottom end 120 p protruding outward from the non-active surface 100c. The first lower insulation layer 108 may have the “L” shape includingthe extension 108 e which surrounds the sidewall of the bottom end 120 pof the through-via 120. In some embodiments, the corners 162 of thealignment key 160 may be rounded by the CMP process for planarizing theprotrusion section 190 as illustrated in FIG. 5K.

FIGS. 6A to 6C are cross-sectional views illustrating a method forfabricating a semiconductor device according to some embodiments of theinventive concepts.

Referring to FIG. 6A, the mask layer 130 may be formed by coating thepositive photoresist on the non-active surface 100 c provided with theprotrusion section 190 formed thereon as illustrated in FIGS. 5A to 5G.The mask layer 130 may have the first thickness T1 on the non-activesurface 100 c and the second thickness T2 less than the first thicknessT1 on the protrusion section 190. Next, the mask layer 130 may beexposed to light in connection with a photolithography process using aphotomask 140 b. Through the photolithography process, a first localregion 141 and a second local region 142 may be exposed to light. Thefirst local region 141 may be provided to define an alignment key (seereference number 160 of FIG. 6C) and the second local region 142 may bedisposed on the protrusion section 190. In some embodiments, thephotomask 140 b may comprise a half-tone phase shift mask (or attenuatedphase shift mask) which is configured to fully and partially expose themask layer 130. In some embodiments, the first local region 141 may betransformed into a full exposure region (e.g., 100% exposure) and thesecond local region 142 may be transformed into a partial exposureregion (e.g., 50% exposure).

Referring to FIG. 6B, the mask layer 130 may be patterned with aphotographic developer capable of selectively removing the first andsecond exposure regions 141 and 142. The first exposure region 141 maybe fully removed to form the opening 130 a which exposes the secondlower insulation layer 109, and the second exposure region 142 may bepartially removed to expose the protrusion section 190. In someembodiments, since the protrusion section 190 is exposed by partiallyremoving the second exposure region 142, there may be no need to recessthe mask layer 130 for exposing the protrusion 190.

Referring to FIG. 6C, the alignment key 160 may be formed. The cappingpart 109 f of the second lower insulation layer 109 may be removedsimultaneously during the formation of the alignment key 160. Forexample, the second lower insulation layer 109 may be patterned by anetching process using the mask layer 130 to form the alignment key 160under the opening 130 a, and the capping part 109 t of the second lowerinsulation layer 109 may be removed at the same time. Next, there may beformed the electrical interconnection part 11 of FIG. 5P by strippingthe mask layer 130, planarizing the protrusion section 190 andelectroplating, for example, according to the processes illustrated atFIGS. 5K to 5P.

FIGS. 7A to 7C are cross-sectional views illustrating a method forfabricating a semiconductor device according to some embodiments of theinventive concepts.

Referring to FIG. 7A, the mask layer 130 may be formed by coating thepositive photoresist on the non-active surface 100 c provided with theprotrusion section 190 formed thereon as illustrated in FIGS. 5A to 5G.Next, the mask layer 130 may be exposed to light by a photolithographyprocess using a photomask 140 c. Through the photolithography process, afirst local region 141 and a second local region 142 may be exposed tolight. The first local region 141 may be provided to define an alignmentkey (see numerical 160 of FIG. 7C) and the second local region 142 maybe disposed on the protrusion section 190. The mask layer 130 may coverthe non-active surface 100 c and the protrusion section 190. In someembodiments, the mask layer 130 may have an even, or level, or planar,top surface. The mask layer 130 may have a first thickness D1 on thenon-active surface 100 c and a second thickness D2 less than the firstthickness D1 on the protrusion section 190. The first thickness D1 ofthe mask layer 130 may be greater than the protrusion length L of theprotrusion section 190. The photomask 140 c may be a binary mask whichis configured to fully expose the mask layer 130 so that each of thefirst and second local regions 141 and 142 may be formed into a fullexposure region (e.g., 100% exposure). Alternatively, the photomask 140c may be a half-tone phase shift mask (or attenuated phase shift mask)which is configured to fully and partially expose the mask layer 130 sothat the first local region 141 may be formed into a full exposureregion (e.g., 100% exposure) and the second local region 142 may beformed into a partial exposure region (e.g., 50% exposure).

Referring to FIG. 7B, the mask layer 130 may be patterned with aphotographic developer capable of selectively removing the first andsecond exposure regions 141 and 142. The first exposure region 141 maybe removed to form a first opening 130 a which exposes the second lowerinsulation layer 109, and the second exposure region 142 may be removedto form a second opening 130 b which exposes the protrusion section 190.In some embodiments, since the protrusion section 190 is exposed throughthe second opening 130 b, there may be no need to recess the mask layer130 for exposing the protrusion 190.

Referring to FIG. 7C, the alignment key 160 may be formed. The cappingpart 109 f of the second lower insulation layer 109 may be removedsimultaneously during the formation of the alignment key 160. Forexample, the second lower insulation layer 109 may be patterned by anetching process using the mask layer 130 to form the alignment key 160under the first opening 130 a and the capping part 109 t of the secondlower insulation layer 109 may be removed at the same time. Next, theremay be formed the electrical interconnection part 11 of FIG. 5P bystripping the mask layer 130, planarizing the protrusion section 190 andelectroplating, etc. as illustrated in FIG. 5K to 5P.

FIG. 8A is a schematic block diagram illustrating an example of memorycards including at least one of electrical interconnection partsaccording to exemplary embodiments of the present inventive concepts.

Referring to FIG. 8A, a memory card 1200 may include a memory controller1220 generally controlling data exchange between a host and the flashmemory device 1210. An SRAM 1221 is used as a work memory of aprocessing unit 1222. A host interface 1223 has a data exchange protocolof a host connected to the memory card 1200. An error correction codingblock 1224 detects and corrects errors contained in data read from themulti-bit flash memory device 1210. A memory interface 1225 interfacesthe flash memory device 1210 according to the example embodiments. Theprocessing unit 1222 generally controls data exchange of the memorycontroller 1220. At least one of the memory device 1210, SRAM 1221 andthe processing unit 1222 may comprise at least one of the semiconductordevice 1 and semiconductor packages 90 and 95 according to the exemplaryembodiments.

FIG. 8B is a schematic block diagram illustrating an example ofinformation process system including at least one of electricalinterconnection parts according to exemplary embodiments of the presentinventive concepts.

Referring to FIG. 8B, an information processing system 1300 may includea memory system 1310 having at least one of the semiconductor device 1and semiconductor packages 90 and 95 according to exemplary embodiments.The information processing system 1300 includes a mobile device or acomputer. For example, the information processing system 1300 mayinclude a modem 1320, a central processing unit 1330, a RAM 1340, and auser interface 1350 which are electrically connected to a system bus1360. The memory system 1310 may include a memory 1311 and a memorycontroller 1312 and have substantially the same configuration as that ofthe memory card 1200 in FIG. 8A. The memory system 1310 stores dataprocessed by the central processing unit 1330 or data input from theoutside. The information process system 1300 may be provided as a memorycard, a semiconductor device disk, a camera image sensor, and otherapplication chipsets. For example, the memory system 1310 may berealized as a solid state drive (SSD). In this case, the informationprocessing system 1300 may stably store large data in the memory system1310.

According to some exemplary embodiments, the insulation layer present onthe bottom end of the through-via may be removed during the formation ofthe alignment key such that burden of the subsequent polishing processmay be reduced. This approach may be operable to prevent or reducedamage and/or breakage of the though-via. As a result, yield andelectrical characteristics of the resulting semiconductor devices may beimproved. Additionally, the formation of the alignment key and removalof the mask layer may be performed in such a state in which thethrough-via is not exposed, which may prevent or reduce thecontamination or particle caused by exposure of the through-via.

Although the present invention has been described in connection with theembodiment of the present invention illustrated in the accompanyingdrawings, it is not limited thereto. It will be apparent to thoseskilled in the art that various substitution, modifications and changesmay be thereto without departing from the scope and spirit of theinvention.

What is claimed is:
 1. A method of forming a semiconductor device,comprising: providing a conductive via extending in a vertical directionthrough a substrate, a first end of the conductive via extending througha first surface of the substrate, so that the first end protrudes in thevertical direction relative to the first surface of the substrate;providing an insulating layer on the first end of the conductive via andon the first surface of the substrate; providing a mask layer on theinsulating layer, and patterning the mask layer to form a mask layerpattern, the mask layer pattern having an opening at a side of theconductive via; removing an upper portion of the mask layer pattern sothat a capping portion of the insulating layer that is on the first endof the conductive via is exposed; and removing a portion of theinsulating layer at a side of, and spaced apart from, the conductivevia, using the mask layer pattern as an etch mask, to form a recess inthe insulating layer, and simultaneously removing the capping portion ofthe insulating layer on the first end of the conductive via.
 2. Themethod of claim 1 further comprising, following removing the portion ofthe insulating layer at a side of, and spaced apart from, the conductivevia, using the mask layer pattern as an etch mask, to form a recess inthe insulating layer, and simultaneously removing the capping portion ofthe insulating layer: planarizing the first end of the conductive via.3. The method of claim 2 wherein, planarizing the first end of theconductive via further results in upper corner portions of the recess inthe insulating layer have a rounded cross-sectional profile.
 4. Themethod of claim 1 further comprising, prior to removing the portion ofthe insulating layer at a side of, and spaced apart from, the conductivevia, using the mask layer pattern as an etch mask, and simultaneouslyremoving the capping portion of the insulating layer: removing at leastan upper portion of the mask layer pattern.
 5. The method of claim 1,further comprising, following removing the portion of the insulatinglayer at a side of, and spaced apart from, the conductive via, using themask layer pattern as an etch mask, and simultaneously removing thecapping portion of the insulating layer: removing the mask layerpattern.
 6. The method of claim 1 wherein forming the insulating layercomprises: forming a lower insulating layer on the first end of theconductive via and on the first surface of the substrate; and forming anupper insulating layer on the lower insulating layer, the upperinsulating layer having etch selectivity with respect to the lowerinsulating layer; wherein removing a portion of the insulating layercomprises removing at least a portion of the upper insulating layer toform the recess in the upper insulating layer.
 7. The method of claim 6wherein removing a portion of the insulating layer further comprisesremoving at least a portion of the lower insulating layer to furtherform the recess in the lower insulating layer.
 8. The method of claim 1wherein providing a mask layer on the insulating layer, comprisesproviding a first portion of the mask layer to a first depth on thefirst surface of the substrate and providing a second portion of themask layer to a second depth on the first end of the conductive via andwherein the first depth is greater than the second depth.
 9. The methodof claim 8 wherein the first portion of the mask layer has an uppersurface that is at a first height relative to the first surface of thesubstrate and wherein the insulating layer on the first end of theconductive via has an upper surface that is at a second height relativeto the first surface of the substrate, and wherein the first height isless than the second height.
 10. The method of claim 1 furthercomprising further removing an upper portion of that mask layer patternto form a recessed mask layer pattern, and removing a portion of theinsulating layer at a side of, and spaced apart from, the conductivevia, using the recessed mask layer pattern as an etch mask.
 11. A methodof forming a semiconductor device, comprising: providing a conductivevia extending in a vertical direction through a substrate, a first endof the conductive via extending through a first surface of thesubstrate, so that the first end projects in a vertical directionrelative to the first surface of the substrate; providing an insulatinglayer on the first end of the conductive via and on the first surface ofthe substrate; providing a mask layer on the insulating layer, andpatterning the mask layer to form a mask layer pattern, the mask layerpattern having an opening at a side of the conductive via; removing anupper portion of the mask layer pattern so that a capping portion of theinsulating layer that is on the first end of the conductive via isexposed; and removing a portion of the insulating layer at a side of,and spaced apart from, the conductive via, using the mask layer patternas an etch mask, to form an alignment key opening in the insulatinglayer; and following forming the alignment key opening, planarizing thefirst end of the conductive via.
 12. The method of claim 11 whereinremoving the portion of the insulating layer at a side of, and spacedapart from, the conductive via, using the mask layer pattern as an etchmask, to form an alignment key opening in the insulating layer, isperformed simultaneous with removing the capping portion of theinsulating layer on the first end of the conductive via.
 13. A methodfor fabricating a semiconductor device, the method comprising: forming athrough-via that penetrates a substrate, the through-via including abottom end that protrudes outward from a bottom surface of thesubstrate; forming a lower insulation layer on the bottom surface of thesubstrate; patterning the lower insulation layer to remove a cappingpart thereof that covers the bottom end of the through-via such that thelower insulation layer remains along sidewalls of the through-viaextending to the bottom end of the through-via; forming an alignment keythat is defined at a recessed portion of the lower insulation layersimultaneously with the removal of the capping part; planarizing thebottom surface of the substrate to expose the bottom end of thethrough-via, and after forming the lower insulation layer, furthercomprising: forming a mask layer on the lower insulation layer;patterning the mask layer to form an opening configured to expose aportion of the lower insulation layer, the exposed portion of the lowerinsulation layer being defined as the alignment key; and recessing themask layer to expose the capping part of the lower insulation layer,wherein the patterning of the lower insulation layer is performed by anetching process that uses the recessed mask layer as an etching mask.14. The method of claim 13, wherein planarizing the bottom surface ofthe substrate comprises polishing the bottom end of the through-via andan extension of the lower insulation layer that covers a sidewall of thebottom end, wherein a corner of the alignment key becomes rounded by thepolishing of the lower insulation layer.